Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced four Multilayer Chip Inductor Series: the CE0603G, CE0603M, ...

BARCELONA, Spain, March 4, 2026 /PRNewswire/ -- At MWC 2026, Fibocom announced the industry's first implementation of Power ...

With overmold designs that enhance mechanical robustness, STI-CO is making a push into military markets for its cable assemblies.

Uniquely configured PA + SPDT integration delivers ultra-fast switching, reduced footprint and lower total system cost for ...

The semiconductor ceramic packaging materials market is set to expand from USD 1.85 billion in 2025 to USD 2.78 billion by ...

The CQM211 5G NR Advanced module is designed to meet the demands of high-bandwidth industrial IoT applications, offering multi-gigabit throughput, in-built GNSS, and flexible form factors for seamless ...

Soitec and Nanyang Technological University, Singapore (NTU Singapore) will announce the successful results of their joint ...

The FGH200M module adopts the IEEE 802.11ah wireless networking protocol, also known as Wi-Fi HaLow, operating in the license ...

Skyworks Solutions, Inc. (Nasdaq: SWKS) announced it will showcase an early 6G new FR3 frequency range RF front-end (RFFE) power amplifier at Mobile World Congress 2026 (MWC26), taking place in ...

Circuits Integrated Hellas (CIH), a company specialising in satellite communication technology, has introduced a new family of compact Ka-band power amplifier modules that combine amplification and ...

L&T Semiconductor Technologies Ltd (LTSCT), a wholly owned subsidiary of L&T, today rolled out its LCC40 IoT module at the Mobil ...

It provides design engineers with a practical architecture, hardware components, and firmware framework for developing reliable and scalable fire-safety devices used in smart homes and building ...